TECHNICAL SPECIFICATIONS

Build volume (mm) x500 y1000 z500
Layer resolution 200-400 microns
Extruder 1 extruder with filament cooling fan
Optional: Dual extrusion
Printing technology FFF- Fused-Filament-Fabrication (FDM*)
Certified materials (bigrep.com/filaments) BigRep PLA, BigRep PETG
BigRep PRO HT (115°C • High Temperature Resistant Filament)

Heating strategy 60° C – 70° C
Printer weight Approx. 250kg
Size (mm) x 1022 y1660 z1500
Power 208 V - 240 V 16A 50/60 Hz
Safety Certifications CE approved
GUI Onboard with industrial top PC
File transfer USB & remotely
*registered trademark (Stratasys)
Build volume (mm) x500 y1000 z500
Layer resolution 200-400 microns
Extruder 1 extruder with filament cooling fan
Optional: Dual extrusion
Printing technology FFF- Fused-Filament-Fabrication (FDM*)
Certified materials (bigrep.com/filaments) BigRep PLA, BigRep PETG
BigRep PRO HT (115°C • High Temperature Resistant Filament)

Heating strategy 60° C – 70° C
Printer weight Approx. 250kg
Size (mm) x 1022 y1660 z1500
Power 208 V - 240 V 16A 50/60 Hz
Safety Certifications CE approved
GUI Onboard with industrial top PC
File transfer USB & remotely
*registered trademark (Stratasys)

All information and technical data subject to change until final release